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首页> 《中国测试》期刊 >本期导读>倒装键合机支撑板模态参数提取与实验验证

倒装键合机支撑板模态参数提取与实验验证

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作者:宫文峰, 黄美发

作者单位:桂林电子科技大学海洋信息工程学院, 广西 北海 536000


关键词:倒装芯片键合机; 模态分析; ANSYS Workbench软件; LMS Test. Lab模块


摘要:

采用ANSYS有限元仿真计算与LMS Test. Lab锤击实验相结合的方法研究支撑板的模态特性。仿真分析得到支撑板的前6阶固有频率和振型,并通过实验验证仿真结果的准确性。将理论计算与试验的结果进行对比分析,得出支撑板的一阶固有频率为400 Hz,高于支撑板上安装的伺服电机的工作频率以及周围环境的激振频率,因此不会产生共振现象,为防止共振、改善整机质量性能及结构优化提供参考依据。


Modal parameter extract and experimental verification of support plate of flip chip bonder

GONG Wen-feng, HUANG Mei-fa

School of Marine Information Engineering, Guilin University of Electronic and Technology, Beihai 536000, China

Abstract: In this paper, the modality characteristic of the support plate is investigated using the ANSYS simulation calculation and LMS Test. Lab hammering experimental test. The first six-order inherent frequency and vibration mode of the support plate are obtained. Experimental and simulation results are compared and analyzed. The results show that first-order inherent frequency is 400 Hz, and the frequency is higher than the external excitation frequency. Therefore, the resonance phenomenon would not occur. This research provides the reference of preventing resonance, improving the quality performance and optimizing the structure.

Keywords: flip chip bonder(FCB); modal analysis; ANSYS workbench; LMS Test. Lab

2014, 40(5): 145-148,152  收稿日期: 2014-4-8;收到修改稿日期: 2014-5-11

基金项目: 国家自然科学基金项目(50865003);"十一五"国家重大专项02专项(2012ZX02601)

作者简介: 宫文峰(1987-),男,山东泰安市人,硕士研究生,专业方向为振动工程与CAE技术。

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