您好,欢迎来到中国测试科技资讯平台!

首页> 《中国测试》期刊 >本期导读>MEMS片上绝缘性能测试高阻标准件研制

MEMS片上绝缘性能测试高阻标准件研制

2955    2017-08-02

免费

全文售价

作者:乔玉娥, 刘岩, 丁晨, 翟玉卫, 梁法国, 郑世棋

作者单位:中国电子科技集团公司第十三研究所, 河北 石家庄 050051


关键词:MEMS片上测试系统;绝缘性能;片上高阻标准件;标定


摘要:

针对MEMS圆片测试系统中绝缘性能测试的准确测量问题,利用GaAs半导体材料硼离子注入后的高绝缘特性,研究制作片上高值电阻标准件的方案,研制出一种基于GaAs衬底的由2个金属电极构成的1 G片上高阻标准件。组建能有效溯源至国家最高标准的定标装置,使用与标准件探针压点坐标匹配的探针卡作为测试夹具,考核出年稳定性优于0.1%的在片标准件。经试验表明:该标准件携带方便、性能稳定,对开展MEMS片上绝缘性能测试提供有效的现场校准方案,有效解决其溯源问题。


Development of high resistance standard for the MEMS on-wafer insulation test

QIAO Yu'e, LIU Yan, DING Chen, ZHAI Yuwei, LIANG Faguo, ZHENG Shiqi

The 13 th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang 050051, China

Abstract: In order to solve the accurate measurement problem of isolation test about MEMS wafer test system, prepared a plan of manufacturing on-wafer high resistance standard parts and developed a kind of 1GΩ on-wafer high resistance standard parts that were composed of 2 metal poles based on GaAs substrate according to the high insulation properties of GaAs semiconductor materials after boron ions were injected, and also developed a calibrated equipment that can effectively trace back to the highest national standard. By using the probe card matched with pad coordinates of standard parts, assessed the wafer standard parts with annual stability superior to 0.1%. The test indicates that the standard part is portable with stable performance, which provides effective field calibration plan and can effectively solve the source tracing problem.

Keywords: MEMS on-wafer test system;insulation performance;on-wafer high resistance standard;evaluation

2017, 43(7): 88-91  收稿日期: 2016-11-29;收到修改稿日期: 2016-12-12

基金项目: 

作者简介: 乔玉娥(1980-),女,河北石家庄市人,高级工程师,硕士,研究方向为电磁仪器计量技术研究。

参考文献

[1] ESCHENBURG A, HABIB T. 通过晶圆片检测MEMS器件[J]. 电子工业专用设备,2010(2):14-16.
[2] MARSHALL J C, VERNIER P T. Electro-physical technique for post-fabrication measurements of CMOS process layer thicknesses[J]. Journal of Research of the National Institute of Standards and Technology,2007,112(5):223-256.
[3] MARSHALL J C. New optomechanical technique for measuring layer thickness in MEMS processes[J]. Journal of Microelectromechanical Systems March,2001,10(1):153-157.
[4] 乔玉娥,刘岩,程晓辉,等. MEMS晶圆级测试系统现状及未来展望[J]. 传感器与微系统,2016,35(10):1-3,7.
[5] 皮埃罗. 半导体器件基础-国外电子与通信教材系列[M]. 黄如,王漪,王金延,等译. 北京:电子工业出版社,2004:11-17.
[6] 于信明,崔玉兴. GaAs工艺监测研究[J]. 半导体技术,2011,36(7):520-523.
[7] 俸永格,刘文进. 绝缘材料高阻测量方法初探[J]. 海南大学学报(自然科学版),2003,21(3):234-237.
[8] ZANT P V. 芯片制作[M]. 韩郑生,译. 6版. 北京:电子工业出版社,2005:23-33.
[9] 赵振业,段光安. 微弱电流及V/I法高阻测量[J]. 测量与测试,2001(3):6-7.
[10] 张秀勇,龚向曙,王海燕,等. 高阻测量技术方法研究[C]//2012国防计量与测试学术交流会,2012:523-525.
[11] 乔玉娥,范雅洁,杜蕾,等. MEMS晶圆片测试系统绝缘电阻参数校准技术研究[C]//2015国防计量与测试学术交流会,2015:29-32.
[12] BEILEY M, LEUNG J, WONG S S. A micromachined array probe card-fabrication process[J]. IEEE Trans on Components Packaging and Manufacturing Technology-part B,1995,18(1):179-183.